





|
At PCSM we work with your engineering team to develop custom processes for everything from standard PCBs to new concepts.
| Description |
Standard |
Review |
| Layer Count |
16 |
24 |
| Board Thickness/Maximum |
.250" |
.450" |
| Copper Foil Thickness, Minimum |
.5oz/ft2 |
.25oz/ft2 |
| Copper Foil Thickness, Maximum External/Internal Layers |
2oz/ft2 |
10oz/ft2 |
| Through hole size Minimum Drilled |
.010" |
.008" |
| Hole Size, Plated, Diameter Tolerance |
+/-.003" |
+/-.002 |
| Hole Size, Non-Plated, Diameter Tolerance |
+/-.002" |
+/-.001" |
| Trace/Space Width |
.005"/.005" |
.003"/.003" |
| SMT Pitch |
.019" |
below .019" |
| Materials |
Rigid Flex
Flex
FR4
FR408, Getek
Polyimide
High Speed (RO4003,4350,etc)
Ceramic (TMM Series,etc)
BT
Teflon(Rogers Duroid, etc)
|
Other |
| Final Finish |
HASL
Immersion Silver
ENIG
Hard Gold
(130-180 Knoop)
Specialty Hard Gold (200-250 Knoop) |
Other |
Contact us so that we can establish a relationship for mutual success. |